J031043 導電性接着剤接合部の熱疲労寿命の加速評価に関する検討([J03104]電子情報機器,電子デバイスの強度・信頼性評価と熱制御(4))

概要

論文の詳細を見る
Recently, conductive adhesives have been used as alternative to Pb-free solders. They have high heat resistance and bonded at lower temperature than Pb-free solders. Therefore, thermal fatigue life of Pb-free solder has been investigated by accelerated test based on a mechanical method. In this study, thermal and bending fatigue life of Pb-free solder and conductive adhesives was evaluated and accelerated mechanical test method was established for conductive adhesives. As a result, bending fatigue life of conductive adhesives is depends on the strain range as well as solders on this research. And fracuture mode and relative life ratio of Pb-free solder to conductive adhesives on thermal fatigue test were substituted by mechanical bending fatigue test.
一般社団法人日本機械学会の論文
2011-09-11