Advances and Challenges in 3D Physical Design

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概要

• 論文の詳細を見る

• The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.

• 一般社団法人情報処理学会の論文
• 2010-02-15

著者

• Jason Cong

  Computer Science Department, University of California, Los Angeles | California NanoSystems Institute

• Guojie Luo

  Computer Science Department, University of California, Los Angeles

関連論文

• Advances and Challenges in 3D Physical Design

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