RF Interconnect Technology for On-Chip and Off-Chip Communication(Session 3B : High Speed and High Frequency Applications 1)
スポンサーリンク
概要
- 論文の詳細を見る
One of the most difficult remaining problems in wire interconnect architectures is providing low latency and high concurrency on a shared bus or link without increasing communication resources, power dissipation, and complexity. Novel improvements in on- and off-chip wire interconnects can be provided by using a multi-band RF interconnect (RF-I). Unlike the conventional current- or voltage-mode square wave signaling transceivers using binary or multilevel signals, the RF-I transceiver utilizes high frequency modulated RF signals based on FDMA modulations. We discuss the limitation of conventional time-division multiplexing (TDM) protocol-based signaling technologies and examine the improvements in RF-I technology for on-chip and off-chip reconfigurable communications.
- 2010-06-23
著者
-
Kim Jongsun
Electronic and Electrical Engineering, Hongik University
-
Byun Gyungsu
Electrical Engineering, University of California, Los Angeles (UCLA)
-
Chang M.
Electrical Engineering, University of California, Los Angeles (UCLA)
-
Kim Jongsun
Electronic And Electrical Engineering Hongik University
-
Byun Gyungsu
Electrical Engineering University Of California Los Angeles (ucla)
-
Chang M.
Electrical Engineering University Of California Los Angeles (ucla)
関連論文
- RF Interconnect Technology for On-Chip and Off-Chip Communication(Session 3B : High Speed and High Frequency Applications 1)
- RF Interconnect Technology for On-Chip and Off-Chip Communication(Session 3B : High Speed and High Frequency Applications 1)
- A Low-Overhead and Low-Power RF Transceiver for Short-Distance On- and Off-Chip Interconnects