Electromigration Characteristics of Reflow Sputtered AlSiCu Metallization
スポンサーリンク
概要
著者
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Yamaha T
Electronic Devices Division Yamaha Corporation
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Naito Masaru
Electronic Devices Division, YAMAHA Corporation
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Yamaha Takahisa
Electronic Devices Division, YAMAHA Corporation
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Hotta Tadahiko
Electronic Devices Division, YAMAHA Corporation
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Naito Masaru
Electronic Devices Division Yamaha Corporation
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Hotta Tadahiko
Electronic Devices Division Yamaha Corporation
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Hotta Tadahiko
Electric Devices Division Yamaha Corporation
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Yamaha Takahisa
Electric Devices Division Yamaha Corporation
関連論文
- Electromigration Characteristics of Reflow Sputtered AlSiCu Metallization
- Via Electromigration Characteristics in Aluminum Based Multilevel Interconnection (Special Section on Reliability)
- Influence of Titanium Film on MOS Transistor Characteristics in Annealing Process