J0406-3-6 超音波による積層試料の欠陥検出技術の検討(超音波計測・解析法の新展開(3))

概要

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The semiconductor package in now a day has advanced 3-dimension structure with multi-layer silicon chip, and every layer is extremely thin. For example, the memory chip often has tens layers for large memory space and small size. So the advanced analysis technology for ultrasonic imaging system become important, and the development of the technology is needed instantly. In this paper, a pseudo-defect sample in a multi-layer package is prepared for experimental and theoretical analysis. It is noticed that the residual vibration component in later part of signal shows a little difference between the normal package and that with defect. The difference is considered to be caused by the defect. Two type image processing methods for making clear S/N of the small difference are discussed. (1) to abstract the difference in frequency domain, (2) to abstract the difference in time domain. The result shows even so only the simple signal processing method is used, the image of detect become more clear than before.
社団法人日本機械学会の論文
2009-09-12