S1302-1-2 ダイヤモンド平バイトによる単結晶シリコンの高能率旋削加工技術の開発(超精密加工(1))

スポンサーリンク

概要

• 論文の詳細を見る

• Turning of single crystal silicon on a (100) surface was carried out using straight-nosed single crystal diamond cutting tool with a rake angle of -20°, and a side cutting edge angle of 5°. This side cutting edge angle enables the turning of silicon in high depth of cut. The surface roughness of the work piece was about 20nm PV, when the feed speed of the tool was 0.3mm/min and 0.6mm/min, depth of cut was 10μm, revolution speed of the work piece was 3000min^<-1>. During the turning of silicon, cutting force was measured by using cutting force dynamometer, and relation between the cutting force and tool feed speed was also investigated.

• 2009-09-12

著者

• 齊藤 寛史

  山形県工業技術センター

関連論文

• S1302-1-2 ダイヤモンド平バイトによる単結晶シリコンの高能率旋削加工技術の開発(超精密加工(1))
• CNTを含有した機能性めっき被膜の開発と工具への応用

スポンサーリンク