C18 New Nano Fabrication Method by Combination of Nano Plastic Forming and Etching Technologies

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概要

• 論文の詳細を見る

• A new process to fabricate various submicron structures on the surface of hard brittle materials without utilizing photolithography method is proposed. The process combines metal deposition, nano plastic forming (NPF), and etching technologies as one complete sequence. A silicon wafer is used as substrate, and it is coated with thin metal layer by deposition technique, which layer works as a mask of etching process. Then submicron structure is drawn on the metal layer by using nano plastic forming instead of UV or electron beam patterning. The patterned specimen was etched first by the sputter etching, then by KOH (wet etching) to fabricate submicron pattern on the silicon wafer. This process was studied experimentally, and feasibility of the process is confirmed.

• 一般社団法人日本機械学会の論文
• 2008-11-21

著者

• Yoshino Masahiko

  東工大

• TASHIDI Hassan

  Department of Mechanical and Control Engineering, Tokyo Institute of Technology

• Tashidi Hassan

  Department Of Mechanical And Control Engineering Tokyo Institute Of Technology

関連論文

• C18 New Nano Fabrication Method by Combination of Nano Plastic Forming and Etching Technologies

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