Reduction of Mutual Coupling in a Microstrip Patch Array Fed by a Triplate Waveguide with EBG Elements(<Special Section>Metamaterials for Microwave and Millimeter-Wave Applications)
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概要
- 論文の詳細を見る
This letter presents mutual coupling reduction in an E-plane arranged microstrip patch array fed by a triplate waveguide. Five mushroom-like electromagnetic band-gap (EBG) elements arranged in one column are embedded both between two radiating patches and between the feeding lines for suppression of the surface wave and the parallel plate mode, respectively. Validity of the proposed EBG elements is confirmed by the measurement.
- 社団法人電子情報通信学会の論文
- 2006-09-01
著者
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Haneishi Misao
Department Of Electrical And Electronic Systems Saitama University
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Haneishi Misao
Department Of Electrical And Electronic Saitama University
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Kimura Yuichi
Department Of Electrical And Electronic Systems Saitama University
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OKAGAKI Toru
Department of Electrical and Electronic Systems, Saitama University
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NAKANO Kazuo
Department of Electrical and Electronic Systems, Saitama University
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Okagaki Toru
Department Of Electrical And Electronic Systems Saitama University
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Kimura Yuichi
Department Of Clinical Cariology And Endodontology Showa University School Of Dentistry
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Nakano Kazuo
Department Of Electrical And Electronic Systems Saitama University
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