421 LIFE PREDICTION OF SN-AG-CU SOLDER JOINTS WITH SURFACE FINISH UNDER LONG TERM THERMAL STRESS CONDITION(4th JWS-KWJS Young Reseacher Symposlum)
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概要
- 論文の詳細を見る
- 社団法人溶接学会の論文
- 2008-03-17
著者
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Hong Won
Physics Of Failure Research Center Korea Electronics Technology Insititute
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Han Chang
Physics Of Failure Research Center Korea Electronics Technology Insititute
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Kim Noh-chang
Physics Of Failure Research Center Korea Electronics Technology Insititute
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Oh Chul
Physics of Failure Research Center, Korea Electronics Technology Insititute
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Oh Chul
Physics Of Failure Research Center Korea Electronics Technology Insititute