415 CHARACTERIZATION AND RELIABILITY EVALUATION OF SN-AG-CU-IN QUATERNARY SOLDER ALLOY(4th JWS-KWJS Young Reseacher Symposlum)

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概要

• 論文の詳細を見る
• 社団法人溶接学会の論文
• 2008-03-17

著者

• Lee Jong-hyun

  Microjoining Center Advanced Joining Technology Team Kitech

• Kim Jeong-han

  Microjoining Center Advanced Joining Technology Team Kitech

• Yu A-mi

  Microjoining Center Advanced Joining Technology Team Kitech

関連論文

• 415 CHARACTERIZATION AND RELIABILITY EVALUATION OF SN-AG-CU-IN QUATERNARY SOLDER ALLOY(4th JWS-KWJS Young Reseacher Symposlum)

スポンサーリンク