C-9 WIRING TECHNOLOGY USING SILVER NANOPASTE^(R) BY MEANS OF INK-JET PRINTING AND LASER SINTERING FOR MICROFABRICATION(Session: Forming II)
スポンサーリンク
概要
- 論文の詳細を見る
In this work, the feasibility of minute wiring by means of-ink jet printing with Ag NanoPaste^(R) and its laser sintering is investigated. Laser sintering twice in a row by scanning a pulsed Nd:YAG laser beam of 1.06μm wavelength and 0.1 mm spot diameter at average laser powers of 1.99 W and 4.45 W in air is most favorable. The Ag nano particles with around 5 nm in diameter stabilized by dispersant and organic solvent are melted to form coarse agglomerates of about 1μm on the Cu substrate. The agglomerates were identified as Ag, while a slight peak of Cu was observed, which means that solid phase diffusion occurs at the interface.
- 一般社団法人日本機械学会の論文
- 2006-11-08
著者
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MAEKAWA Katsuhiro
The Research Center for Superplasticity, Faculty of Engineering, Ibaraki University
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YAMASAKI Kazuhiko
The Research Center for Superplasticity, Ibaraki University
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Maekawa Katsuhiro
The Research Center For Superplasticity College Of Engineering Ibaraki University
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Saito Hirokazu
The Research Center For Superplasticity College Of Engineering Ibaraki University
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Mita Mamoru
The Research Center for Superplasticity, College of Engineering, Ibaraki University
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Matsuba Yorishige
The Research Center for Superplasticity, College of Engineering, Ibaraki University
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Terada Nobuto
The Research Center for Superplasticity, College of Engineering, Ibaraki University
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Saito Hitoshi
The Research Center for Superplasticity, College of Engineering, Ibaraki University
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Mita Mamoru
The Research Center For Superplasticity College Of Engineering Ibaraki University
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Terada Nobuto
The Research Center For Superplasticity College Of Engineering Ibaraki University
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Matsuba Yorishige
The Research Center For Superplasticity College Of Engineering Ibaraki University
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Yamasaki Kazuhiko
The Research Center For Superplasticity College Of Engineering Ibaraki University
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