IGTC-59 Stress Rupture Behavior of a Silicon Nitride under Combustion Gas Environment(Session C-2 EVALUATION OF CERAMIC MATERIALS)

概要

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Stress rupture testing of silicon nitride material was performed under a combustion gas environment. The dominant mechanism of the rupture was creep and it was independent of the environment at each temperature tested. Water vapor had quite a few effects on the rupture time of the present material. Oxidation, however, enhanced the creep deformation. At 1200 and 1300℃, the fracture origins were large grains and the rupture was caused by internal stresses around the grains. At 1400℃, the rupture was mainly caused by creep damages. A master rupture curve by Larson-Miller parameter was applied for a life time prediction in a practical sense and it worked. This result also supports the idea that creep mechanism is responsible for the rupture. The prediction was also performed in a theoretical sense. Eshelby's equivalent inclusion method was used. The predicted rupture time was in good agreement with the experimental result.
公益社団法人日本ガスタービン学会の論文