Development of Direct Patterning by Ink-jet Process Using NanoPaste^[○!R](Synergy by Microparticulation)

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概要

• 論文の詳細を見る

• Direct patterning of NanoPaste^[○!R] was demonstrated on various substrates. The thermal behavior of silver nanoparticles was investigated. Nanoparticle of 5nm in diameter can be sintered at temperature much lower than silver melting point to form a bulk metallic structure. Patterns with 70μm L/S was obtained by piezo type ink jet printer. Super ink jet technology provides the ultra-fine patterning with several micrometer rules and produces micro-bumps that are three dimensional structures. The sintering process was newly developed for copper NanoPaste^[○!R] and copper circuit patterning was achieved by ink-jet printing.

• 一般社団法人日本機械学会の論文
• 2006-09-19

著者

• Terada Nobuto

  Tsukuba Research Laboratory Harima Chemicals Inc.

• Matsuba Yorishige

  Tsukuba Research Laboratory Harima Chemicals Inc.

関連論文

• Development of Direct Patterning by Ink-jet Process Using NanoPaste^[○!R](Synergy by Microparticulation)

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