High-performance flip-chip BGA technology based on thin-core and coreless package substrate (ICEP2007英文論文特集)

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概要

• 論文の詳細を見る

• A new organic build-up substrate packaging technology was developed in Fujitsu for high-end servers, where lower V-G impedance on substrate and thermal resistance are realized by applying metallic thermal injection materials. In the present paper, two important accomplishments in assembling process, eliminating voids with metallic thermal injection and controlling substrate flatness on mounting large LSIs, are investigated, and evaluated.

• 2008-05-01

著者

• Sato Toshihisa

  Fujitsu Limited

• Abe Kenichiro

  Fujitsu Interconnect Technologies Limited

• Koide Masateru

  Fujitsu Limited

• Fukuzono Kenji

  Fujitsu Limited

• Fujisaki Hidehiko

  Fujitsu Interconnect Technologies Limited

関連論文

• High-performance flip-chip BGA technology based on thin-core and coreless package substrate (ICEP2007英文論文特集)

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