B223 半導体デバイス用の高性能ヒートシンク(エレクトロニクス機器・デバイスのサーマルマネージメント1)

概要

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Performance of semiconductor devices has strong temperature dependence. The cooling technology is a key technology for semiconductor devices. In this study, we have developed water cooled heat sinks for a laser diode bar. Experimental study was conducted to investigate the effect of shape of a cooling channel. Cooling channel has contracting part and bending part into upward diode and expanding part into downward diode. Water flow was impinging to a wall under the diode bar. Thermal resistance of heat sink is 0.35℃/W without increasing pressure drop.
2006-11-23