On shielding vertical interconnections for high-speed multilayer boards (環境電磁工学)

概要

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Comparative analysis of two types of shielding vertical interconnections formed by signal and ground vias in a multilayer board will be presented in the frequency band up to 20GHz. In the first type, the clearance hole for each ground via is used as a way to pass a power supply layer or a ground layer. The second type comprises an isolating slot around all ground vias for providing their isolation from the power supply layer or the ground layer. For testing both types of shield vertical interconnections, the parasitic wave effect is artificially created by an in-board resonator formed by conductor planes and via fences connected to these conductor planes.
社団法人電子情報通信学会の論文
2008-01-18