Feature Extraction for Fillet Profile of Pb-free Solder and Its Application to Inspection(Physics, Processes, Instruments & Measurements, INTERNATIONAL SYMPOSIUM OF JWRI 30TH ANNIVERSARY)

概要

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An image processing technique for characteristic extraction of microsoldering fillet pattern is discussed from the viewpoint of the external feature inspection system. The visual inspection system for the shape of Pb-free solder fillet aims to decrease the influence of surface roughness. When the surface roughness affects the luminance distribution of a solder fillet profile, two methods are proposed ; binarization and band summation. In experiments, the two kinds of Pb-free solder are adopted (Sn-Ag-Cu and Sn-Ag-Bi-In systems). Images of solder fillets are observed by CCD digital microscope by changing the incident light angle and image processing is carried out. It is found that binarization and band-summation are useful for the characteristic extraction. The two methods decrease the influence of surface roughness and make the characteristics clear.