Copper Thermal Diffusion in TaN Film on Si Substrate
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2002-11-15
著者
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Jiang Lei
Materials Science Department Fudan University
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He P
Tsinghua Univ. Beijing Chn
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HE Ping
Materials Science Department, Fudan University
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HE Guowei
Materials Science Department, Fudan University
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ZONG Xiangfu
Materials Science Department, Fudan University
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LEE Chiaping
Departinent of Chemical Engineering, National Taiwan University of Science and Technology
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He Ping
Materials Science Department Fudan University
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He G
Southeast Univ. Nanjing Chn
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Zong Xiangfu
Materials Science Department Fudan University
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Lee Chiaping
Departinent Of Chemical Engineering National Taiwan University Of Science And Technology
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He Guowei
Materials Science Department Fudan University