Machining of CVD diamond film by RIE, Laser Ablation and Thermo-chemical Polishing(Ultra-precision machining)

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概要

• 論文の詳細を見る

• Diamond, having many advanced physical and mechanical properties, is one of the most important materials used in the mechanical, telecommunication and optoelectronic industry. However, high hardness value and extreme brittleness have made diamond a very difficult material to be machined by conventional mechanical grinding and polishing. In the present study, the microwave CVD method was employed to produce epitaxial diamond films on silicon single crystal. Reactive ion etching (RIE), laser ablation and thermo-chemical polishing experiments were then conducted on the obtained diamond films. The underlying material removal mechanisms, microstrucrure of the machined surface and related machining conditions were also investigated. It was found that during the laser ablation, peaks of the diamond grains were removed mainly by the photo-thermal effects introduced by excimer laser. The diamond structures of the protruded diamond grains were transformed by the laser photonic energy into graphite, amorphous diamond and amorphous carbon which were removed by the subsequent laser shots. Laser ablation could improve the surface roughness from above 1μm to around 0.1μm in few minutes' time in this study. However scanning would be required to cover a large area, and, as a consequence, it could be very time consuming. Thermo-chemical polishing, in the other hand, was proved to be able to remove the diamond film very effectively (4.8μm deep of diamond film was removed in 30 minutes when polishing at 550℃ and 5.7m/s) and the removal rate increased with polishing speed, temperature and pressure. Gases such as O_2, O_2/CF_4, O_2/SF_6 were used as the reactive gases in the RIE experiments and it was found that O_2 and O_2/SF_6 offered better results. However, the obtained etch rates were higher at areas like grain boundary and sharp corners which made further improvement of surface roughness very difficult.

• 一般社団法人日本機械学会の論文
• 2005-10-18

著者

• Huang S.w.

  Department Of Mechanical And Electro-mechanical Engineering Tam-kang University

• Chao C.L.

  Department of Mechanical and Electro-mechanical Engineering, Tam-Kang University

• Chou W.C.

  Department of Mechanical and Electro-mechanical Engineering, Tam-Kang University

• Ma K.J.

  Department of Mechanical Engineering, Chung-Hua University

• Chen T.T.

  Department of Mechanical Engineering, Chung-Cheng Institute of Technology

• Liu Y.M.

  Department of Mechanical Engineering, Chung-Cheng Institute of Technology

• Lin H.Y.

  Mechanical Industry Research Laboratories, Industrial Technology Research Institute

• Ma K.j.

  Department Of Mechanical Engineering Chung-hua University

• Lin H.y.

  Mechanical Industry Research Laboratories Industrial Technology Research Institute

• Liu Y.m.

  Department Of Mechanical Engineering Chung-cheng Institute Of Technology

• Chou W.c.

  Department Of Mechanical And Electro-mechanical Engineering Tam-kang University

• Chen T.t.

  Department Of Mechanical Engineering Chung-cheng Institute Of Technology

• Chen T.t.

  Department Of Mechanical Engineering Chung Cheng Institute Of Technology

• Chao C.l.

  Department Of Mechanical And Electro-mechanical Engineering Tam-kang University

関連論文

• Investigation of the Microscopic Performance of an Aerostatic Precision Positioning Stage Driven by the Air-lubricated Friction Drive(Precision positioning and control technology)
• Machining of CVD diamond film by RIE, Laser Ablation and Thermo-chemical Polishing(Ultra-precision machining)
• Micro-ultrasonic machining of various brittle materials(Advances in non-traditional machining)

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