Effect of Micrestructure on Material Removal Mechanisms in Nano/Micro Grinding of Tungsten Carbide Mould Inserts(M^4 processes and micro-manufacturing for science)

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概要

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• Nano/micro grinding of tungsten carbide (WC) mould inserts was performed. A form accuracy of 〜200nm (in PV) and a surface roughness of 〜7nm were achieved. Nanoindentation revealed that small chipping or cracking occurred even at a penetration depth of 38nm, which could hinder the further improvement of surface quality during grinding. It was found that when grinding was conducted at nanometric scale, the microstructure of the work material and the morphology of the WC grains should be taken into account to enable a fully ductile removal.

• 一般社団法人日本機械学会の論文
• 2005-10-18

著者

• Kuriyagawa T.

  Department Of Nanomechanics Tohoku University

• HUANG H.

  School of Engineering, The University of Queensland

関連論文

• Effect of Micrestructure on Material Removal Mechanisms in Nano/Micro Grinding of Tungsten Carbide Mould Inserts(M^4 processes and micro-manufacturing for science)

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