Fabrication of micro-optical elements in fused silica with laser backside etching(Laser processing)

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概要

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• One of the urgent challenges of current laser material processing is the high quality and precise etching of transparent materials for, e.g., microoptical applications. Indirect laser processing techniques such as LIBWE and LESAL (laser-induced backside wet etching, laser etching at a surface adsorbed layer, respectively) allow the accurate etching of transparent materials like fused silica at low laser fluences, with etch rates in the nanometer scale and a low roughness. In combination with established laser processing techniques, e.g., mask projection, scanning contour mask technique, and direct writing, these etch techniques allow the direct machining of dielectric materials with almost optical quality. The etching of diffractive and refractive topographies for micro prism arrays, free-form surfaces, as well as periodically sub-micron structures with nanometer depth accuracy and a low roughness is demonstrated.

• 一般社団法人日本機械学会の論文
• 2005-10-18

著者

• Bohme Rico

  Leibniz-institut Fur Oberflachenmodifizierung E. V.

• ZIMMER Klaus

  Leibniz-Institut fur Oberflachenmodifizierung e. V.

• RAUSCHENBACH Bernd

  Leibniz-Institut fur Oberflachenmodifizierung e. V.

関連論文

• Ion Beam Figuring (IBF) Solutions for High Performance Optics Surface Finishing from Meter to Millimeter Spatial Wavelength Range(Advances in non-traditional machining)
• Fabrication of micro-optical elements in fused silica with laser backside etching(Laser processing)

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