Sn-3.0 Ag-0.5 Cu鉛フリーはんだ材の衝撃引張特性

概要

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In order to investigate the tensile characteristics of lead-free solder at high strain rates, impact tensile test equipment for solder materials was developed, on the basis of the direct tension split Hopkinson bar technique. By using this equipment, tensile stress-strain characteristics data of the Sn-3.0 Ag-0.5 Cu lead-free solder and the Sn-Pb conventional solder up to fracture were measured with a high accuracy at strain rate of 1.66×10^3 and compared with those at quasi-static strain rates of 1.2 and 1.2×10^<-2>. The results show that the proof stress and tensile strength of the Sn-3.0 Ag-0.5 Cu lead-free solder increase significantly with increasing strain rate comparing with the Sn-Pb conventional solder. It is also shown that the fracture morphology of Sn-3.0 Ag-0.5 Cu solder changes from ductile fracture to brittle fracture with increase in the strain rates.
一般社団法人日本機械学会の論文
2004-02-25