高電流効率のパラジウムめっき処理法の開発

概要

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Palladium was electroplated on copper at 25-100A/m^2 in the bath (1) containing 49mol/m^3 PdCl_2, 765mol/m^3 NH_4OH, 440mol/m^3 NH_4H_2PO_4 and 237mol/m^3 NH_4Cl, the bath (2) containing 13mol/m^3 (NH_3)_2Pd(NO_2)_2, 56mol/m^3 NaNO_2, 386mol/m^3 NH_4NO_3 and 525mol/m^3 HNO_3, and the bath (3) containing 22mol/m^3 PdCl_2, 743mol/m^3 Na_2HPO_4, 183mol/m^3 NH_4H_2PO_4 and 216mol/m^3 C_6H_5COOH. The current efficiency for palladium deposition in the bath (1) was nearly equal to 100% at 25-40A/m^2 and smaller at a larger current density. In the case of the baths (2) and (3), the efficiency was smaller, that is, 10-50%. Consequently, the bath (1) is concluded to be superior. Hydrogen in the electroplating palladium film was analyzed by measuring its thermal evolution spectrum. Three peaks were observed in the thermal spectrum of the hydrogen evolution rate. The area of the hydrogen evolution peaks, which is propotional to the concentration of hydrogen, has been higher at a larger current density.
福井工業大学の論文
2003-03-20