SiCの切断加工および研磨加工に伴う欠陥に関する研究

概要

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As a result of research on slicing SiC polycrystalline bulk materials into thin round plate, it was found that wire saw of horizontal type is more suitable for slicing difficult-to-machine materials like SiC than that of vertical one and that a combination of plain steel wire and diamond slurry is more preferable than diamond dispersed Cu plated wire. Crystalline distortion introduced by slicing, polishing of β-SiC was investigated with X-ray diffraction and each surface subjected to processing like slicing, mechanical polishing and chemo-mechanical polishing was not thought to be distorted.
福井工業大学の論文
2003-03-20