Growth Kinetics of Cu-Sn Intermetallic Compounds at Interface of 80Sn-20Pb Electrodeposits and Cu Based Leadframe Alloy, and Its Influence on the Fracture Resistance to 90°-Bending
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 2000-10-15
著者
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KWON HYUK-SANG
Department of Internal Medicine, College of Medicine, The Catholic University of Korea
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Suh M‐s
Lg Electronics Inc. Seoul Kor
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Kwon H‐s
Seoul National Univ. Seoul Kor
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Kwon Hyuk-sang
Department Of Internal Medicine College Of Medicine The Catholic University Of Korea
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SUH Min-Suk
Department of Materials Science and Engineering, Korea Advanced Institute of Science and Technology
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Suh Min-suk
Department Of Materials Science And Engineering Korea Advanced Institute Of Science And Technology
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- Growth Kinetics of Cu-Sn Intermetallic Compounds at Interface of 80Sn-20Pb Electrodeposits and Cu Based Leadframe Alloy, and Its Influence on the Fracture Resistance to 90°-Bending
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