Attempt to Evaluate the Bond Quality of Thin Soldered Laminate Using the Laser Lamb Wave
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概要
- 論文の詳細を見る
Noncontact evaluation of the bond quality of a thin soldered laminate was attempted by quantitative analysis of the laser Lamb wave. We developed a computer algorithm for calculation of the velocity dispersion of the Lamb wave for a perfect and slip contact three-layer laminate, and measured the velocity dispersion of soldered copper foil using a laser Lamb system. We propose a method for estimation of the bond quality by comparing the measured velocity dispersion of the Ag-Lamb wave with that computed for the model laminate.
- 社団法人応用物理学会の論文
- 1997-05-30
著者
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Takemoto Mikio
Faculty Of Science And Engineering Aoyama Gakuin University
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FUTATUGI Takashi
Graduate School, Aoyama Gakuin University
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Futatugi Takashi
Graduate School Aoyama Gakuin University
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Takemoto Mikio
Faculty of Mechanical Engineering, Aoyama Gakuin University, 5-10-1 Fuchinobe, Sagamihara, Kanagawa 229-8558, Japan
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