Thermal Fatigue Life Prediction of Gull-Wing Solder Joints in Plastic Thin Small Outline Packages
スポンサーリンク
概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1996-11-15
著者
-
Lee Kwon-woo
Package Development Memory Division Semiconductor Business Samsung Electronics Co. Ltd.
-
LEE Seong-Min
Package Development, Memory Division, Semiconductor, Samsung Electronics Co., Ltd.
-
Lee Seong-min
Package Development Memory Division Semiconductor Business Samsung Electronics Co. Ltd.
関連論文
- The Optimization of Passivation Layout Structure for Reliability Improvement of Memory Devices
- Thermal Fatigue Life Prediction of Gull-Wing Solder Joints in Plastic Thin Small Outline Packages