Effect of Thermal Curing on Thermomechanical Properties of Polyimide Films Having Rodlike Molecular Skeleton Formed on a Silicon Substrate
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概要
- 論文の詳細を見る
Stresses in polyimide films coated on silicon wafers were measured in situ during the curing and cooling cycles. The films had a single rodlike molecular skeleton. Stress measurements were performed on films of uniform thickness under several different heating rates during the curing cycle. After the stress measurements, the cured polyimide films were examined by thermal mechanical analysis. The stress after the curing cycle increased with increasing heating rate during the curing cycle. Similarly, the thermal coefficient of expansion of the cured polyimide film increased with increasing heating rate. This phenomenom was thought to be caused by the decrease in the degree of in-plane orientation of the polyimide molecular chain with increased heating rate. The in-plane orientation was presumed to be influenced by the evaporation rate of the residual solvent.
- 社団法人応用物理学会の論文
- 1995-11-15
著者
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Asano Masaya
Electronic And Imaging Materials Research Laboratories Toray Industries Inc.
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Nomura Hideshi
Electronic And Imaging Materials Research Laboratories Toray Industries Inc.
関連論文
- Interfacial Interaction between Nematic Liquid Crystal and Polymer in the Composite Film Consisting of Nematic Liquid Crystal and Connected Polymer Microspheres
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- Electrooptical Properties of Polymer Films Containing Nematic Liquid Crystal Microdroplets
- Effect of Thermal Curing on Molecular Orientation in Polyimide Films Having Rodlike Molecular Skeleton Formed on Substrates
- Effect of Thermal Curing on Thermomechanical Properties of Polyimide Films Having Rodlike Molecular Skeleton Formed on a Silicon Substrate
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