Thermal Analysis of a New High Density Package Cooling Technology Using Low Melting Point Alloys
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概要
- 論文の詳細を見る
- 社団法人応用物理学会の論文
- 1991-06-15
著者
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Ishizuka Masaru
Fluid Thermal Engineering Group Mechanical Engineering Laboratory Toshiba R & D Center Toshiba C
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FUKUOKA Yoshitaka
Advanced Hybrid IC Engineering Section, Hybrid IC Engineering Department, Printed Circuit Board & Mo
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Ishizuka Masaru
Fluid Thermal Engineering Group Mechanical Engineering Laboratory Toshiba R & D Center Toshiba C
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Fukuoka Yoshitaka
Advanced Hybrid Ic Engineering Section Hybrid Ic Engineering Department Printed Circuit Board &
関連論文
- Thermal Analysis of a New High Density Package Cooling Technology Using Low Melting Point Alloys
- New Package Cooling Technology Using Low Melting Point Alloys