Wet Chemical Etching Behavior of Ga(Al)As and In(Ga)P(As) Layers
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概要
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The chemical etching behavior of Ga(Al)As and In(Ga)P(As) containing sandwich layers grown by metalorganic vapor phase epitaxy has been investigated using various etching solutions. The chemical background is described by a potential-pH diagram. Activation energies obtained were between 0.28 and 0.46 eV. The inclination angle of the etched walls is mainly 55°. In both the systems, a transition from a reaction-rate limited process to a diffusion-rate-limited one is observed. In InP, a reactive intermediate with an inclination angle of 45° could be trapped.
- 社団法人応用物理学会の論文
- 1991-11-15
著者
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Franz Gerhard
Siemens Research Laboratories
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HOYLER Charlotte
Siemens Research Laboratories
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SACHER Dagmar
Siemens Research Laboratories