Electron-Beam Testing of Microwiring Substrates

概要

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The miniaturization of microwiring substrates which are used for high-density chip packaging imposes increasing problems on electrical testing. Mechanical probes fail to contact pads reliably in the 50 μm range and are limited to a fixed pad configuration. An electron-beam test system has been developed to overcome these problems. It uses CAD data for flexible beam positioning within a 10 cm×10 cm field. An electron probe with a spot size of 40 μm is used for charging networks and reading pad voltages. The system has already demonstrated its operation by detecting shorts and opens on a limited number of substrates which were rejected as defective by a mechanical prober during the final test of the current production.
社団法人応用物理学会の論文
1990-11-20