異材界面端における圧縮残留応力の発生条件

概要

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In elastic dissimilar materials joint subjected to cooling or heating, thermal stresses at the intersection of the edges and the interface are singular. The thermal stresses are represented by the sum of the singular solutions, the no singular solutions and the particular solutions. In this paper, relationship between two stress intensities (K_1 and K_2) for the singular solutions and wedge angles of materials is theoretically investigated for the metal/ceramics composite. The bonded wedge angle, at which the intensities become zero, is shown. The distribution patterns of K_1 and K_2 around the interface edge correspond to mode I and II, respectively. The sign of distribution varies against combination of the wedge angles. The bonded wedge angle yielding K_1 (or K_2)=0 and the conditions for disappearance of stress singularity based on both the stress exponents and intensities are shown on the φ_1+φ_2 (total angle of bonded wedge)-φ_1 (wedge angle of material 1) plane. From this plane, combinations of the wedge angles, at which compressive thermal stress is induced around the interface edge, can be found. In addition, thermal stresses around the interface edge in case of finite bodies are analyzed using FEM.
社団法人溶接学会の論文
1999-02-05