Bonding of Si_3N_4 to Metals with Active Filler Metals

概要

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Bondings of Si_3N_4 to refractory metals were carried out in a vacuum furnace and a vacuum chamber using Cu-base binary alloys containing Cr, Nb, V, Ti and Zr as active filler metals. Bonding strength was evaluated by shear test. The highest strengths of each Si_3N_4-W joint using Cu-5%Cr, Cu-1%Nb, Cu-3%V, Cu-5%Ti and Cu-10%Zr filler metal were about 150MPa, 140MPa, 140MPa, 180MPa and 180MPa, respectively. Reaction layers composed of nitrides and silicides of Cr, Nb, V, Ti and Zr existed at the interfaces between Si_3N_4 and bonding layers, and a Cu-enriched buffer layer was found in the bonding layer in each joint. The thermodynamic calculation suggested that nitrides and silicides were formed by the reaction between Si_3N_4 and the melted filler metals. It was made clear that the growth of a reaction layer could be expressed by a Johnson-Mehl type equation with time exponent 'n' of 1/2. From the value of activation energy for the growth of each reaction layer, it was deduced that the growth of each reaction layer was controlled by diffusion process of Cr, Nb, V, Ti and Zr in each reaction layer from the melted filler metal to Si_3N_4.
社団法人溶接学会の論文
1989-04-01