A Study on Wetting by Solders by Surface Tension Methods : Equilibrium Wetting

概要

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Important factors in testing methods of quantitatively evaluating the wettability of a soldering system are discussed. It is shown that adhesion tension obtained by the surface tension method is a basically important factor controlling the wetting phenomenon, and that the wetting behaviour may be interpreted from various points of view such as spreading and penetration characteristics. Experimental results obtained by the surface tension methods on equilibrium wetting of copper by tin-lead solders with rosin flux are described. These give an explanation of the discrepancies between the results of the area-of-spread and capillary-penetration tests, and give an insight into the slight differences between the results of the area-of-spread tests and the practical assessments of solder performance. It is found that the adhesion tension exerts dominant influence on practical soldering, and the surface tension method can be expected to be useful for the quantitative evaluation of solderability.
社団法人溶接学会の論文
1979-04-01