Existence of Plating Layer at the Surface and its Effects on Joining Characteristics : Micro-Parallel Seam Joining and Development of Joining Equipment (1st Report)
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概要
- 論文の詳細を見る
Among several hermetically sealing methods, we studied experimentally on Micro-Parallel Seam Joining (MPSJ) used for hermetic seal of high reliable ceramic package for semiconductor devices, particularly paying attention to the relationship between plated materials on the package and lid and its warn joining characteristics to verify the MPSJ phenomena. Results obtained are summarized as follows: (1) Cracks were observed on the ceramic substrate immediately after seam joining; they were considered to be caused by a difference in thermal expansion coefficient in the case where austenitic stainless steel, SUS-316 lid was used. Therefore, it will be necessary to use Fe-Ni-Co Alloy, Kovar as a lid material which has a similar thermal expansion coefficient to the ceramic substrate (A1_2O_3). (2) Seam joined area consisted of a mutually diffused layer at the joining boundary formed by plating material for the lid and seal frame and a fillet formed around the circumferential edge of the lid. No molten layer of both base materials existed. (3) The main reason for (2) is the fact that density of heat generation at the joining boundary decreases because current path area expands due to softening and fusion of plating material concurrent with the current flow. Therefore, both the con-tact resistance between the lid and roller electrodes and the inherent resistance of the lid will be major heat generation sources. Consequently, lid and seal frame will be joined by brazing under pressure of plating material. (4) From the above results, it has been verified that plating material for the lid and seal frame plays an important role in securing the specified hermeticity in the case of hermetic sealing of ceramic packages by MPSJ.
- 社団法人溶接学会の論文
- 1986-10-01
著者
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Aono Susumu
Avionics Company Ltd.
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Aono Susumu
Nippon Avionics Co. Ltd.
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Tanaka Kazutoshi
Nippon Avionics Company Ltd.
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SATOH Hidenori
Nippon Avionics Company Ltd.
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ISHIHARA Reiji
Nippon Avionics Company Ltd.
関連論文
- Newly Developed Micro-Parallel Seam Joining Equipment and its Applications : Micro-Parallel Seam Joining and Development of Joining Equipment (4th Report)
- Influence of Bath Constituent on Microstructure and Joining Characteristics of Plating Layer at the Joining Interface : Micro-Parallel Seam Joining and Development of Joining Equipment (3rd Report)
- Surface Temperature of Ceramic Package and Seam Joining Condition : Micro-Parallel Seam Joining and Development of Joining Equipment (2nd Report)
- Existence of Plating Layer at the Surface and its Effects on Joining Characteristics : Micro-Parallel Seam Joining and Development of Joining Equipment (1st Report)