Lead-free bumping and its process integrity for fine pitch interconnects

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概要

• 論文の詳細を見る

• Electroplated solder bumps allow much finer pitch interconnection for high I/O applications, although controlling the alloy deposition is challenging. To overcome problems concerning alloy plating, we have developed the Pb-free bumping process to employ multi-stack electroplating and it has been qualified to exhibit wide versatility of solder materials and compositions. In this study, from the reliability viewpoint of solder joints, the integrity of the stack plating process is discussed. Emphasis is placed on void formation in the stack-plated bumps.

• 社団法人電子情報通信学会の論文
• 2005-09-02

著者

• Ezawa Hirokazu

  Toshiba Corporation Semiconductor Company Advanced Ulsi Process Engineering Department

• Seto Masaharu

  Toshiba Corporation Semiconductor Company Advanced ULSI Process Engineering Department

• Higuchi Kazuhito

  Toshiba Corporation Semiconductor Company Advanced ULSI Process Engineering Department

関連論文

• Lead-free bumping and its process integrity for fine pitch interconnects
• Lead-free bumping and its process integrity for fine pitch interconnects

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