モルディング物質によって生じる寄生容量の分析的モデリング
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概要
- 論文の詳細を見る
As the dielectric constant of molding materials is greater than that of vacuum in a normal chip, the parasitic capacitances among metal lines are increased. To analyze the phenomena a modeling of parasitic capacitances caused by modeling materials proposed. According to the model, the parasitic capacitances are about 1. 5 times larger on the average than that conventional ones.
- 社団法人電子情報通信学会の論文
- 1996-03-11
著者
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Kang Bongsoon
Media Team Micro Devices Business Samsung Electronics Co. Ltd.
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Song Minkyu
Media Team Micro Devices Business Samsung Electronics Co. Ltd.
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Kim Seongwon
Media Team,Micro Devices Business,Samsung Electronics,Co.,Ltd.
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Joe Euro
Media Team,Micro Devices Business,Samsung Electronics,Co.,Ltd.
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Kang Geunsoon
Media Team,Micro Devices Business,Samsung Electronics,Co.,Ltd.
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Kang Geunsoon
Media Team Micro Devices Business Samsung Electronics Co. Ltd.
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Joe Euro
Media Team Micro Devices Business Samsung Electronics Co. Ltd.
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Kim Seongwon
Media Team Micro Devices Business Samsung Electronics Co. Ltd.