Automatic LSI Package Lead Inspection System with CCD Camera for Backside Lead Specification

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概要

• 論文の詳細を見る

• An automatic LSI package lead inspection system for backside lead specification is proposed. The proposed system inspects not only lead backside contamination but also the mechanical lead specification such as lead pitch, lead offset and lead overhangs (variations in lead lengths). The total inspection time of a UQFP package with a lead count of 256 is less than the required time of 1 second. Our proposed method is superior to the threshold method used usually, especially for the defect between leads.

• 社団法人電子情報通信学会の論文
• 2003-04-01

著者

• Nakamae Koji

  The Authors Are With Graduate School Of Information Science And Technology Osaka University

• Fujioka Hiromu

  The Authors Are With Graduate School Of Information Science And Technology Osaka University

• TAMAMURA Wataru

  The authors are with Graduate School of Information Science and Technology, Osaka University

• Tamamura Wataru

  The Authors Are With Graduate School Of Information Science And Technology Osaka University

関連論文

• Automatic LSI Package Lead Inspection System with CCD Camera for Backside Lead Specification

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