High-Density 3D Packaging Sidewall Interconnection Technology for CCD Micro-Camera Visual Inspection System
スポンサーリンク
概要
- 論文の詳細を見る
- 2002-04-01
著者
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Kimura Masanobu
Personal And Multimedia Systems Development Center Toshiba Corporation
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Sudo Hajime
Corporate Research & Development Center Toshiba Corporation
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Togasaki Takashi
Corporate Manufacturing Engineering Center Toshiba Corporation
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YAMADA Hiroshi
Corporate Research & Development Center, Toshiba Corporation
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Yamada Hiroshi
Corporate Research & Development Center Toshiba Corporation