Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique(<特集>Special Issue on Superconductive Electronics)

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概要

• 論文の詳細を見る

• We have developed and demonstrated a novel technique for electrical inspection and electrical failure analysis, which can detect open, high-resistance, and short circuits without the need for electrical contact with the outside of the LSI chip or the hoard on which the LSI chip is mounted. The basic idea of the technique is the detection of the magnetic field produced by OBIC (optical beam induced current) or photo current. A DC-SQUID (superconducting quantum interference de- vice) magnetometer is used to detect the magnetic field. This scanning laser-SQUID microscopy ("laser-SQUID" for short) has a spatial resolution of about 1.3 μm. It can be used to distinguish defective chips before bonding pad patterning or after bonding without pin-selection. It can localize any defective site in the chip to within a few square microns.

• 社団法人電子情報通信学会の論文
• 2002-03-01

著者

• Nikawa Kiyoshi

  Analysis Technology Development Division Nec Electron Devices Nec Corporation

関連論文

• Laser-SQUID Microscopy as a Novel Tool for Inspection, Monitoring and Analysis of LSI-Chip-Defects: Nondestructive and Non-electrical-contact Technique(Special Issue on Superconductive Electronics)

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