Characterisation of Offset Lithographic Films Using Microelectronic Test Structures (Special Issue on Microelectronic Test Structures)

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概要

• 論文の詳細を見る

• This paper reports on the use of microelectronic test structures to characterise a novel fabrication technique for thin-film eletronic circuit boards. In this technology circuit tracks are formed on paper-like substrates by depositing films of a metal-leaded ink via, a standard lithographic printing process. Sheet resistance and linewidth for both horizontal and vertical lines are electrically evaluated and these compared with optical and surface profiting measurements.

• 社団法人電子情報通信学会の論文
• 1999-04-25

著者

• Fallon Martin

  National Semiconductor Larkfield Industrial Estate

• Haworth Leslie

  Department Of Electrical Engineering University Of Edinburgh

• Harrison David

  Department Of Design Brunel University

• Walton Anthony

  Department Of Electrical Engineering University Of Edinburgh

• STEVENSON J.

  Department of Electrical Engineering, University of Edinburgh

• EVANS Peter

  Department of Design, Brunel University

• RAMSEY Blue

  Department of Design, Brunel University

• Evans Peter

  Department Of Design Brunel University

• Ramsey Blue

  Department Of Design Brunel University

• Stevenson J.

  Department Of Electrical Engineering University Of Edinburgh

関連論文

• Characterisation of Offset Lithographic Films Using Microelectronic Test Structures (Special Issue on Microelectronic Test Structures)

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