Low Cost Optical Module Packaging Techniques for Optical Access Network Systems (Special Issue On Devices, Packaging Technology, and Subsystems for the Optical Access Network)

概要

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This paper describes packaging techniques based on a novel passive alignment technique as key techniques for module assembly. A laser diode (LD) is passively positioned by detecting a pair of alignment marks located on the LD and Si substrate. A single-mode fiber is self aligned on a Si V groove. A simple receptacle structure for the module output port is also newly designed. This structure is more suitable for the automatic assembly line as well as the module mounting process on circuit board. In this paper, an advanced module applications such as a hybrid integrated wave guide module and a surface mountable (SMT) LD module is introduced.
社団法人電子情報通信学会の論文
1997-01-25