Two-Phase Thermosyphon Cooling for High-Power Multichip Modules

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A high-efficiency air cooling system is one of the keys to achieving high throughput in an ATM switching system for Broadband ISDN. Our approach is to cool the multichip modules plugged into a planar packaging system by using a two-phase thermosyphon cold-plate with an air-cooled condenser. Physically separating the cold-plate and the air-cooled condenser and connecting item by small diameter pipes is the key to applying this cooling technology to large planar packaging systems to increase volumetric packaging densities. Furthermore, thermosyphon technology allows the heat transfer process to operate without any external pumping power. Therefore this cooling system is regarded an extended high-performance air cooling system. The optimum structure was investigated while focusing on ways to reduce the external thermal resistance. The external thermal resistance between the system's cold-plate and air inlet was measured to be 0.21 K/W at an air velocity of 2m/s and a cooling duty of 150 watts. Using this external thermal resistance value, we simulated the cooling characteristics of an MCM containing a 4×4 array of 10-mm-square LSI chips on an alumina substrate measuring 100×100 mm. For an allowable temperature rise of 60℃, simulated thermal resistance was 6K/W at an air flow of 2m/s. This allows a power dissipation of more than 160 watts per MCM and a heat flux of 1.6W/cm^2. This system will extend the applicability of air cooling to power levels generally considered to lie in the domain of liquid cooling, and thus to the ATM switching nodes for B-ISDN.
社団法人電子情報通信学会の論文
1994-06-25

Two-Phase Thermosyphon Cooling for High-Power Multichip Modules

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