Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems

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概要

• 論文の詳細を見る

• An innovative small planar packaging (SPP) system is described that can be combined with card-on-board (COB) packaging in high-speed asynchronous transfer mode switching systems with throughput of over 40-Gb/s. The SPP system provides high I/O pin count density and high packaging density, combining the advantages of both planar packaging used in computer systems and COB packaging used in telecommunication systems. Using a newly developed quasi-coaxial zero-insertion-force connector, point-to-point 311 Mb/s of 8-bit parallel signal transmission is achieved in an arbitrary location on the SPP system's shelf. Also about 5400 I/O connections in the region of the planar packaging system are made, thus the SPP system effectively eliminates the I/O pin count limitation. Furthermore, the heat flux management capability of the SPP system is five times higher than of conventional COB packaging because of its air flow control structure. An SPP system can easily enlarge the switch throughput and it will be useful for future high-speed, high-throughput ATM switching systems.

• 社団法人電子情報通信学会の論文
• 1998-10-25

著者

• Oka Hiroki

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• Kaizu Katsumi

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• KISHIMOTO Tohru

  The authors are with NTT Network Service Systems Labs., NTT ATM Backbone Network Systems Project

• YASUNA Keiichi

  The authors are with NTT Network Service Systems Labs., NTT ATM Backbone Network Systems Project

• SASAKI Sinichi

  The authors are with NTT Network Service Systems Labs., NTT ATM Backbone Network Systems Project

• KANEKO Yasuo

  The authors are with NTT Network Service Systems Labs., NTT ATM Backbone Network Systems Project

• Kishimoto Tohru

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• Kaneko Yasuo

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• Sasaki Sinichi

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

• Yasuna Keiichi

  The Authors Are With Ntt Network Service Systems Labs. Ntt Atm Backbone Network Systems Project

関連論文

• Small Planar Packaging System Combined with Card-On-Board Packaging for High-Speed, High-Density Switching Systems

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