Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA(Special Issue on Microwave and Millimeter Wave Technology)

スポンサーリンク

概要

• 論文の詳細を見る

• Electronics packaging evolution involves both systems, technology & materials considerations. In this paper, we present a novel 3D integration approach for system-on-package (SOP) based solutions for wireless communication applications. This concept is proposed for the 3D integration of a C band Wireless LAN (WLAN) RF front-end module by means of stacking LCP (Liquid Crystal Polymer) substrates using μBGA technology. LCP substrates fabrication, high Q inductor design and the associated physical based modeling are detailed. Then stacking techniques using μBGA technology is presented. Characterization and modeling of RF vertical board-to-board transition, using μBGA process are detailed and show that this vertical transition is suitable for C-band wireless communication applications.

• 社団法人電子情報通信学会の論文
• 2003-08-01

著者

• Laskar Joy

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• Sundaram Venky

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• Pinel Stephane

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• DAVIS Mekita

  Packaging Research Center, Yamacraw Design Center, School of Electrical and Computer Engineering Geo

• LIM Kyutae

  Packaging Research Center, Yamacraw Design Center, School of Electrical and Computer Engineering Geo

• WHITE George

  Packaging Research Center, Yamacraw Design Center, School of Electrical and Computer Engineering Geo

• TUMMALA Rao

  Packaging Research Center, Yamacraw Design Center, School of Electrical and Computer Engineering Geo

• Lim Kyutae

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• Tummala Rao

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• Davis Mekita

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

• White George

  Packaging Research Center Yamacraw Design Center School Of Electrical And Computer Engineering Georg

関連論文

• Cost-Effective RF Front-End Module Using High Q Passive Components on Liquid Crystal Polymer Substrates and Micro-BGA(Special Issue on Microwave and Millimeter Wave Technology)

スポンサーリンク