Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring

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概要

• 論文の詳細を見る

• Copper strips plated with Sn-Pb eutectic solder were hot pressure-bonded to gold thin-film wiring. It was proven that a Au-Sn alloy forms at the interconnection between the gold thin film and the copper strip, but that there is virtually no Pb present in the interconnection. Au, Sn, and Pb were observed on the surfaces of the copper strips and the gold thin film outside of the connection area.

• 社団法人電子情報通信学会の論文
• 1996-08-25

著者

• Shibata Susumu

  LSI Assembly Division Electronic Devices Group, Oki Electric Industry Co., Ltd.

• Kimura Masaru

  Lsi Assembly Division Electronic Devices Group Oki Electric Industry Co. Ltd.

• Shibata Susumu

  Lsi Assembly Division Electronic Devices Group Oki Electric Industry Co. Ltd.

関連論文

• Examination of High-Speed, Low-Power-Consumption Thermal Head
• Interconnection of Solder-Plated Copper Strips to Thin-Film Gold Wiring

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