Two-Dimensional Thermal Stress Analysis of Surface Mount Joints under Uniform Temperature Change
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概要
- 論文の詳細を見る
This study deals with the thermal stress in a surface mount joint under uniform temperature change, where an upper element is mounted on a substrate and is ad-hesively bonded/soldered near both ends. The analytical approach is developed mainly in the case of a plane strain state and general solutions for the thermal stress and the strain distributions in the joint are derived using a two-dimensional theory of elasticity. It is shown by numerical calculations that the thermal stress is singular at both edges of the interfaces between the upper element and the adhesive, and between the substrate material and the adhesive. Maximum principal thermal stresses are examined in order to predict the fracture initiation point in different types of surface mount joints. In the experiments, the thermal stress distribution in an adhesive layer is measured using photoelasticity. In comparisons between the analytical results and the experimental ones, fairly good agreement is shown.
- 一般社団法人日本機械学会の論文
- 1995-10-15
著者
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Sawa T
Yamanashi Univ. Yamanashi Jpn
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Sawa Toshiyuki
Department of Mechanical Engineering, Yamanashi University
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Nakano Y
Department Of Mechanical Engineering Shonan Institute Of Technology
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Nakano Yuichi
Department Of Mechanical Engineering Suzuka College Of Technology
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Nakagawa Fumito
Department of Mechanical Engineering, Tokyo Metropolitan College of Aeronautical Engineering
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Nakano Yuichi
Department Of Mechanical Engineering Sagami Institute Of Technology
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Sawa Toshiyuki
Department Of Internal Medicine Gifu City Hospital
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Nakagawa Fumito
Department Of Mechanical Engineering Tokyo Metropolitan College Of Aeronautical Engineering
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