Three-Dimensional FEM Stress Analysis for Bonded Dissimilar Plates with Various Thicknesses

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概要

• 論文の詳細を見る

• The distributions of stress induced by an applied stress σ_0 in five joint plate specimens (copper/silicon nitride) with different thicknesses were calculated using three-dimensional (3-D) FEM stress analysis and the results were compared with those obtained using two-dimensional (2-D) FEM stress analysis. Along the longitudinal center line perpendicular to the interface on the surface of the specimen, the 3-D FEM calculation predicted a maximum stress of approximately 1. 36σ_0 in the interfacial region in the silicon nitride, with a minimum stress of 0.9σ_0 appearing in the copper. On the other hand, the 2-D FEM predicted only slight change in the stress in the interfacial region, giving a value close to the applied stress σ_0. The maximum stress decreased more rapidly with decreasing thickness of the specimen, and the stress value agreed more closely with the value calculated by the 2-D FEM as the distance from the interface increased.

• 一般社団法人日本機械学会の論文
• 1995-07-15

著者

• Kurita Masanori

  Nagaoka University Of Technology

• Fujita M

  Fukuoka Dental Coll. Fukuoka Jpn

• Fujita Makoto

  Murata Co.

• Yoneda Kiyohiro

  Nagaoka University of Technology

関連論文

• Two-Dimensional Surface Roughness Measurement Using Scattered Light(Optical Method 3)
• Three-Dimensional FEM Stress Analysis for Bonded Dissimilar Plates with Various Thicknesses

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