158mm幅のTAB(Tape Automated Bonding)技術
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概要
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In the field of mounting technology, setting change from flat package to TAB package is advancing rapidly. We developed technology of TAB process with 158 mm tape width for new calculator, watch, and LCD display production system. This TAB technology will also be applied to high-density LCD module. In this paper, our whole TAB process (gold bump formation, tape carrier fabrication, and inner lead bonding) is described as well as some important informations of TAB for LCD application and future assignments.
- 1991-06-20