高密度実装を可能にするICのパッシベーション膜について
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概要
- 論文の詳細を見る
Generally, the integrated circuits consist of the device area and the area for connection with the other substrates via contact pads. This connection area usually occupies 20〜30 percent of the whole IC area which is a great drawback for the IC size reduction. By forming contact pads on the insulating film over the device area, the connection area can be virtually eliminated and this structure allows the application of various packaging techniques. We have developed the insulating film which is endurable with the mechanical damage due to the IC inspection probes or the pressure at wire bonding. Also, the planarization of this film have been achieved to meet the need for further device mounting.
- 社団法人日本時計学会の論文
- 1987-09-20